Micron MT16JTF1G64AZ-1G6E1 Ficha Técnica

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DDR3 SDRAM UDIMM
MT16JTF25664AZ – 2GB
MT16JTF51264AZ – 4GB
MT16JTF1G64AZ – 8GB
Features
DDR3 functionality and operations supported as per
component data sheet
240-pin, unbuffered dual in-line memory module
(UDIMM)
Fast data transfer rates: PC3-14900, PC3-12800,
PC3-10600, PC3-8500, or PC3-6400
2GB (256 Meg x 64), 4GB (512 Meg x 64), 8GB (1 Gig x
64)
V
DD
= V
DDQ
= 1.5V ±0.75V
V
DDSPD
= 3.0–3.6V
Reset pin for improved system stability
Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
Dual rank
8 internal device banks for concurrent operation
Fixed burst length (BL) of 8 and burst chop (BC) of 4
via the mode register
Adjustable data-output drive strength
Serial presence-detect (SPD) EEPROM
Gold edge contacts
Halogen-free
Addresses are mirrored for second rank
Fly-by topology
Terminated control, command, and address bus
Figure 1: 240-Pin UDIMM (MO-269 R/C B)
Module height: 30.0mm (1.181in)
Options Marking
Operating temperature
1
Commercial (0°C T
A
+70°C) None
Industrial (–40°C T
A
+85°C) I
Package
240-pin DIMM (halogen-free) Z
Frequency/CAS latency
1.07ns @ CL = 13 (DDR3-1866) -1G9
1.25ns @ CL = 11 (DDR3-1600) -1G6
1.5ns @ CL = 9 (DDR3-1333) -1G4
1.87ns @ CL = 7 (DDR3-1066) -1G1
Note:
1. Contact Micron for industrial temperature
module offerings.
Table 1: Key Timing Parameters
Speed
Grade
Industry
Nomenclature
Data Rate (MT/s)
t
RCD
(ns)
t
RP
(ns)
t
RC
(ns)
CL =
13
CL =
11
CL =
10 CL = 9 CL = 8 CL = 7 CL = 6 CL = 5
-1G9 PC3-14900 1866 1600 1333 1333 1066 1066 800 667 13.125 13.125 47.125
-1G6 PC3-12800 1600 1333 1333 1066 1066 800 667 13.125 13.125 48.125
-1G4 PC3-10600 1333 1333 1066 1066 800 667 13.125 13.125 49.125
-1G1 PC3-8500 1066 1066 800 667 13.125 13.125 50.625
-1G0 PC3-8500 1066 800 667 15 15 52.5
-80B PC3-6400 800 667 15 15 52.5
2GB, 4GB, 8GB (x64, DR) 240-Pin DDR3 UDIMM
Features
PDF: 09005aef837cdd2d
jtf16c256_512_1gx64az.pdf - Rev. I 04/13 EN
1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2008 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
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Resumo do Conteúdo

Página 1 - DDR3 SDRAM UDIMM

DDR3 SDRAM UDIMMMT16JTF25664AZ – 2GBMT16JTF51264AZ – 4GBMT16JTF1G64AZ – 8GBFeatures• DDR3 functionality and operations supported as percomponent data

Página 2 - Features

Electrical SpecificationsStresses greater than those listed may cause permanent damage to the module. This is astress rating only, and functional oper

Página 3 - Pin Assignments

DRAM Operating ConditionsRecommended AC operating conditions are given in the DDR3 component data sheets.Component specifications are available on Mic

Página 4 - Pin Descriptions

IDD SpecificationsTable 12: DDR3 IDD Specifications and Conditions – 2GB (Die Revision G)Values are for the MT41J128M8 DDR3 SDRAM only and are compute

Página 5

Table 13: DDR3 IDD Specifications and Conditions – 4GB (Die Revision M)Values are for the MT41J256M8 DDR3 SDRAM only and are computed from values spec

Página 6 - PDF: 09005aef837cdd2d

Table 14: DDR3 IDD Specifications and Conditions – 4GB (Die Revision K)Values are for the MT41J256M8 DDR3 SDRAM only and are computed from values spec

Página 7

Table 15: DDR3 IDD Specifications and Conditions – 8GB (Die Revision D)Values are for the MT41J512M8 DDR3 SDRAM only and are computed from values spec

Página 8 - Functional Block Diagram

Table 16: DDR3 IDD Specifications and Conditions – 8GB (Die Revisions E and J)Values are for the MT41J512M8 DDR3 SDRAM only and are computed from valu

Página 9 - General Description

Serial Presence-Detect EEPROMFor the latest SPD data, refer to Micron's SPD page: www.micron.com/SPD.Table 17: Serial Presence-Detect EEPROM DC O

Página 10 - Electrical Specifications

Module DimensionsFigure 3: 240-Pin DDR3 UDIMM 30.50 (1.20)29.85 (1.175)Pin 117.3 (0.68)TYP2.50 (0.098) D(2X)2.30 (0.091) TYP5.0 (0.197) TYP123.0 (4.84

Página 11 - DRAM Operating Conditions

Table 2: AddressingParameter 2GB 4GB 8GBRefresh count 8K 8K 8KRow address 16K A[13:0] 32K A[14:0] 64K A[15:0]Device bank address 8 BA[2:0] 8 BA[2:0] 8

Página 12 - Specifications

Pin AssignmentsTable 6: Pin Assignments240-Pin UDIMM Front 240-Pin UDIMM BackPin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Sym

Página 13

Pin DescriptionsThe pin description table below is a comprehensive list of all possible pins for all DDR3modules. All pins listed may not be supported

Página 14

Table 7: Pin Descriptions (Continued)Symbol Type DescriptionSDA I/O Serial data: Used to transfer addresses and data into and out of the temperature s

Página 15

DQ MapTable 8: Component-to-Module DQ MapComponentReferenceNumberComponentDQ Module DQModule PinNumberComponentReferenceNumberComponentDQ Module DQMod

Página 16

Table 8: Component-to-Module DQ Map (Continued)ComponentReferenceNumberComponentDQ Module DQModule PinNumberComponentReferenceNumberComponentDQ Module

Página 17 - Serial Presence-Detect EEPROM

Functional Block DiagramFigure 2: Functional Block Diagram DQ DQ DQ DQ DQ DQ DQ DQDQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7U1DM CS# DQS DQS#DQ DQ DQ D

Página 18 - Module Dimensions

General DescriptionDDR3 SDRAM modules are high-speed, CMOS dynamic random access memory mod-ules that use internally configured 8-bank DDR3 SDRAM devi

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